| PART |
Description |
Maker |
| HN2E04F |
MULTI CHIP DISCRETE DEVICE Super High Speed Switching Application
|
Toshiba Corporation
Toshiba Semiconductor
|
| HN7G02FU |
Multi Chip Discrete Device Power Management Switch Application, Inverter Circuit Application, Driver Circuit Application and Interface Circuit Application.
|
TOSHIBA
|
| TH50VSF4682AASB TH50VSF4683AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| DPS128X16A3-85M DPS128X16H3-85M DPS128X16H3-85B DP |
256K X 8 MULTI DEVICE SRAM MODULE, 85 ns, CPGA50 CERAMIC, MODULE, SLCC, PGA-50
256K X 8 MULTI DEVICE SRAM MODULE, 85 ns, CQFP48 GULLWING, SLCC-48
256K X 8 MULTI DEVICE SRAM MODULE, 85 ns, CQIP48 SLCC-48
|
Twilight Technology, Inc.
|
| CYM1841APR-20C CYM1841BPZ-25C CYM1841APY-20C CYM18 |
x32 SRAM Module X32号的SRAM模块
256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72 PLASTIC, SIMM-72
256K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PSMA72 PLASTIC, SIMM-72
256K X 32 MULTI DEVICE SRAM MODULE, 20 ns, PSMA72 PLASTIC, SIMM-72
256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PSMA72 PLASTIC, SIMM-72
256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PSMA64 PLASTIC, SIMM-64
256K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PSMA64 PLASTIC, SIMM-64
256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PZMA64 PLASTIC, ZIP-64
|
Cypress Semiconductor, Corp.
Everlight Electronics Co., Ltd.
Pyramid Semiconductor, Corp.
YEONHO Electronics Co., Ltd.
|
| 585-3211 585-3213 585-3215 585-3221 585-3225 585-3 |
Multi-Chip BASED LED T1 3/4 Bi-Pin
585 SERIES BASED LEDs-MULTI-CHIP SINGLE COLOR DISPLAY CLUSTER, RED, 5.9 mm
|
Dialight Corporation
Dialight PLC
|
| TPCP8J0107 |
TOSHIBA Multi-chip Device Silicon P Channel MOS Type (U-MOSIV) /Silicon NPN Epitaxial Type
|
Toshiba Semiconductor
|
| WED2ZL361MSJ-BC WED2ZL361MSJ26BI WED2ZL361MSJ42BC |
NBL SSRAM MCP
1M X 36 MULTI DEVICE SRAM MODULE, 2.6 ns, PBGA119
1M X 36 MULTI DEVICE SRAM MODULE, 4.2 ns, PBGA119
|
WHITE ELECTRONIC DESIGNS CORP
|
| CMLM0205 |
MULTI DISCRETE MODULE SURFACE MOUNT N-CHANNEL MOSFET AND LOW VF SILICON SCHOTTKY DIODE
MULTI DISCRETE MODULE??SURFACE MOUNT N-CHANNEL MOSFET AND LOW VF SILICON SCHOTTKY DIODE
MULTI DISCRETE MODULE⑩ SURFACE MOUNT N-CHANNEL MOSFET AND LOW VF SILICON SCHOTTKY DIODE
MULTI DISCRETE MODULE?/a> SURFACE MOUNT N-CHANNEL MOSFET AND LOW VF SILICON SCHOTTKY DIODE
|
CENTRAL[Central Semiconductor Corp]
|
| CYM1836 1836 CYM1836PZ-45C CYM1836P8-15C CYM1836P8 |
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, ZMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, SMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, SMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 30 ns, SMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 30 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 30 ns, ZMA64
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 45 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PSMA72
128K x 32 Static RAM Module 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, SMA64
From old datasheet system
|
Cypress Semiconductor, Corp.
Cypress Semiconductor Corp.
CYPRESS[Cypress Semiconductor]
|
| MT2LSYT3272B2G-12L MT4LSYT6472B2G-12L |
32K X 72 MULTI DEVICE SRAM MODULE, 12 ns, DMA160
64K X 72 MULTI DEVICE SRAM MODULE, 12 ns, DMA160
|
RECOM Electronic GmbH
|
| VSM1206 VSM1206KCBT VSM1206KDBT VSM1206KDBW VSM120 |
Bulk Metal? Foil Technology Discrete High Precision Surface Mount Chip Resistor
Bulk Metal庐 Foil Technology Discrete High Precision Surface Mount Chip Resistor
Bulk Metal垄莽 Foil Technology Discrete High Precision Surface Mount Chip Resistor
Bulk Metal㈢ Foil Technology Discrete High Precision Surface Mount Chip Resistor
|
VISAY[Vishay Siliconix]
|
